尺寸:0.75 x 0.050 處理集成電路芯片/處理集成電路芯片高耐熱性 DC-12.4 GHz低插入圖消耗(0.7 dB @ 12.4 GHz)低駐波比 (1.20:1)3x RF 服務器表層 / 2x DC 服務器表層可引線鍵合和可焊接加工利用各線路很快去鑲入涉及到 3x 高的性能 SMA定貨期:6-8周
品牌:Electro-Photonics
好產品淘寶手機端介召
RF/Microwave Evaluation Board
This high performance RF/MW evaluation board is for a 3-port device up to .075 x .050 size. Each board comes with three high performance end launch connectors that are easy to assemble. In addition, this board is solderable and wire bondable. A DC feed line is provided for biasing and a thru is also provided for quick de-embedding.