亚洲一区二区三区在线-欧美一二区-欧美亚洲一区-欧美激情一区

D-Sub致密單位連接方式器AMPHENOL

分享用時：2023-09-06 16:40:00     網頁瀏覽：961

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub高導熱系數拼接器斜角PCB線接有每種封裝戶型經典款：美國計劃和中國軍工用戶型。融洽組合題材股了解表面上一直為金色色，能給出營養要的充裕融洽組合頻繁抉擇三種方法大多板厚：閃光彈金、15μ"和30μ"。相處點要能打造精密五金機械裝備加工廠的航天軍工用級發行版（電機額定功率電壓高至7.5A）以確保健康可信性，同時也能夠具備更經濟性且可商業應用的額定容量電流值為3A的沖壓加工最新版本。

D-Sub聚集計算拼接器標產品系列常從A到E的5種幾乎外殼要求，AMPHENOL的相混聯系器在數據文件數據信號、電源線和同軸通信電纜方位體現了達到18個觸碰點排序。堆疊（雙表層）D-Sub高溶解度聯系器類產品編等同于多種多樣。AMPHENOL新建發的做為PIP補焊細長（或沉式或短型）系列表在AMPHENOL的商用加盟商中兌換成功的 。除此之余，AMPHENOL同時也可以為所有應用軟件展示機，主要包括復合蓋、塑料管防污蓋、養護罩、拼裝機、兩性轉為和任何配適器。

共同點

原則D形接連器

EMI金屬質表殼

插銷接地保護部件凹坑

插入件由抗靜電熱韌度塑料材質制成而成

選用商業區單位公章打交道點

掌握全多方面線接超范圍的變體

各式線接技術參數均能提供電源插座和充電插頭

主要優勢

抓好正規的搞好團結座向

主要是采用批處理制作但變低代價的來解決處理

UL#E232356認可

兼容種種業主要求

適合要求標準規定

特定產品好于管腳焊錫膏或循環電焊焊接

東莞 市立維創展科技信息地區代理經售AMPHENOL我司其他領域行業物料系統，在AMPHENOL，AMPHENOL信自己在搞好行業的的時候中作成可不斷地的確定可為董事創造出中短期和短期實際價值。AMPHENOL的每項行業都銳意創新于持續改良其來設計，購買，研發和交給食品的行為，的努力考慮或達到潛在客戶對全部社會產品鏈中食品管理方法的期望會。AMPHENOL 的銷售將安全性和氛圍愛護當作關鍵主線任務，并通過ISO 14001和OHSAS 18001等排名第一標淮管理系統那些規劃。是，認真和法合法合法性還不夠用。AMPHENOL不但僅嚴格執行法律規定就能制造不斷幣值。

詳細情況知曉AMPHENOL可點擊：//www.zhixianguangzhou.com.cn/article/1321.html

AMPHENOL.png

PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


推薦英文知識
  • 關于THUNDERLINE-Z產品申明
    關于THUNDERLINE-Z產品申明 2020-10-14 15:54:05 蘇州市立維創展現代科技較少集團公司，是英國THUNDERLINE-Z & Fusite該品牌在國的品牌授權銷售渠道銷售，其金屬材料玻離密封性能接線端子，已范圍廣利用于航天部、軍事訓練、通信網等高不靠譜性領域行業。
  • CMD283C3超低噪聲MMIC放大器現貨庫存
    CMD283C3超低噪聲MMIC放大器現貨庫存 2025-08-22 16:41:29 Custom MMIC（現屬 Qorvo）的 CMD283C3 特低吵音 MMIC 圖像電壓放大器運用 3x3 mm 無引線陶瓷廠家 QFN 封裝，速率區域 2 - 6 GHz，有著高增益控制、低吵音、低功耗測試等性能，可廣泛用于于 S/C 頻譜多領域。